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T400 Scanning Acoustic Microscope

Product features   1.Mechanical – Electrical Charact……

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  • Product features

      1.Mechanical – Electrical Characteristics  
    Mechanical-Electrical Characteristics Specifications
    Overall Dimensions 1400mm X 1300mm X 2000mm
    Water Tank Size 690mm X 570mm X 650mm
    Effective Scan Range 450mm X 450mm X 150mm
    Maximum Scan Speed 1000mm/s
    Recommended Image Resolution 1 ~ 4000um
    Repeatability Positioning Accuracy X ≤ ±0.003mm Y, Z ≤ ±0.01mm
    Water Supply/Drainage Pressure water supply, pump drainage
      2.Configuration  
    Name Specifications
    Scanning System X-axis: Linear Motor Module; Y-axis: Lead Screw Module; Z-axis: Lead Screw Module
    Water Tank 690mm X 570mm X 650mm
    Ultrasonic Transmitter & Receiver Bandwidth 500MHz
    High-Speed Data Acquisition Card Sampling Frequency 1.0GHz
    Industrial PC i9 Processor, 32GB RAM, 2TB Hard Drive, Windows 10 64-bit Operating System
    Monitor Two 27″ LCD Monitors
    Inspection Software HeWu Ultrasonic Non-Destructive Testing Software V2.0
      3.Software Functions   (1)Manual Scanning: Manually generates C-scan images to reflect the bonding status of the inspected joint interface, displaying inspection results numerically, including bond rate and defect area. Default calculation method for bond rate is positive peak value.   (2)Probe Alignment with C-scan Image: Moves the probe to the corresponding position of the actual inspected part by clicking on specific pixels in the C-scan image.   (3)Manual Analysis: Performs various edits on generated C-scan images, including framing (confirming valid analysis areas), distance measurement, threshold modification, image cropping, and arc surface compensation for curved surfaces.   (4)Multiple Scanning Modes: Includes A-scan, B-scan, C-scan, quick scan, auto scan, regional scan, and more.   (5)Automatic Report Generation: Generates a comprehensive report post-scan, including final scan images and various scan parameters, allowing for automatic editing and output of the report document.    (6)Probe Management: Enables replacement or editing of probes of different models.   (7)One-click Calibration: Automatically corrects device coordinate offsets and energy changes, ensuring the accuracy and stability of test results.   (8)Stainless Steel Standard Intensity: Comes with a stainless steel standard block compliant with GBT 11259-2015, defining its ultrasonic reflection intensity as 100 STSS. Other materials are calibrated relative to STSS.   (9)Defect Detection Capability: Identifies welding defects, bonding defects, encapsulation delamination, film voids, and good areas. Automatically counts and calculates defect dimensions and areas. Customized services are also available upon request.   (10)Sound Speed Detection: Determines the propagation velocity of sound in the material under test.   Applications:   Heat Sinks, IGBT modules, Direct Bond Copper, Diamond Composite Materials, Carbon Fiber Reinforced Polymer, Electrical Welding Components, Ceramic Materials, Sputtering Target Materials an so on
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T400 Scanning Acoustic Microscope
               

Hiwave specializes in providing ultrasonic scanning microscopes (USM) for precise non-destructive testing in semiconductors and electronics.

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