MICROELECTRONICS
Scanning Acoustic Microscope
What is Scanning Acoustic Microscope (SAM)?
Scanning Acoustic Microscopy (SAM) uses ultrasonic waves to inspect samples for defects, quality issues, and counterfeit components. It works by analyzing the reflection of sound waves to create detailed images of a product’s internal structure without damaging it.
SAM is safer for operators than X-ray inspection and can provide high-resolution images of multiple layers within a product.
Scanning Acoustic Microscope designed by Hiwave
Hiwave created SAM systems to meet customer needs. Our products feature advanced software-driven tools with a flexible, modular design. This allows us to serve startups, growing test labs, electronics distributors, semiconductor designers, and production facilities with tailored SAM solutions.
Our vertically integrated approach enables us to offer flexible options that fit specific customer requirements.
Why Use Scanning Acoustic Microscopy?
Scanning Acoustic Microscopy (SAM) is essential for any semiconductor metrology lab involved in the analysis of new products, materials, customer returns, and package failures. Automated SAM systems help guarantee defect-free production by ensuring high yields in manufacturing processes.
The application of scanning acoustic microscope in microelectronics
chips
chips packaging

Scanning Acoustic Microscope is essential for inspecting microchip interiors, detecting defects like voids and delaminations, ensuring quality, and preventing failures in semiconductor production.

Scanning Acoustic microscope is vital for inspecting chip packaging, detecting hidden defects like cracks and voids. It ensures reliability, improves quality control, and reduces failure risks in electronics.

MICROELECTRONICS
               

Hiwave specializes in providing ultrasonic scanning microscopes (USM) for precise non-destructive testing in semiconductors and electronics.

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