Hiwave Powers China’s First National Automotive Chip Verification Platform
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author：Hiwave
source：Hiwave
time：2025-10-31
catogory：News
On October 28, 2025, China’s first national-level automotive chip standard verification service platform was officially launched in Shenzhen. This landmark platf……
On October 28, 2025, China’s first national-level automotive chip standard verification service platform was officially launched in Shenzhen. This landmark platform, jointly established by the China Academy of Information and Communications Technology (CAICT) and several authoritative institutions, marks a historic breakthrough in China’s quality verification and evaluation capabilities for automotive-grade chips, laying a solid technological foundation for the high-quality development of the intelligent automotive industry.
The platform integrates 13 specialized laboratories, including those for environmental reliability, failure analysis, information security, and performance testing. Equipped with over 80 sets of internationally advanced testing equipment, it possesses verification capabilities for more than 30 automotive chip standards. Its testing scope comprehensively covers 9 major categories and 81 subcategories of automotive chips, including all critical application scenarios such as intelligent driving, smart cockpit, safety control, and power management. The platform is dedicated to establishing a unified and authoritative automotive-grade chip testing standard system.
As a key technological supporter in the platform’s construction, Hiwave has contributed core testing equipment to the platform’s Failure Analysis Laboratory — the Scanning Acoustic Microscope (SAM).
In the reliability verification of automotive-grade chips, internal micro-defects—such as delamination, cracks, voids, and inclusions—are critical hidden risks that can lead to chip failure. Traditional destructive testing methods are not only time-consuming but also prevent continuous monitoring of the same sample. Hiwave’s Scanning Acoustic Microscope (SAM), utilizing high-frequency ultrasonic imaging technology, enables non-destructive, high-resolution, and highly sensitive 3D imaging of internal chip structures, accurately detecting micron-level defects and providing critical data support for reliability assessment and failure analysis.
Hiwave’s SAM systems are renowned for their exceptional imaging stability, automated operation workflows, and analysis capabilities compliant with international standards, meeting the stringent testing requirements of automotive-grade chips. This technology not only supports the national verification platform but is also widely applied across high-end manufacturing sectors such as semiconductors, new energy, and aerospace.
This collaboration is a vivid demonstration of Hiwave’s philosophy: “Advancing Quality Through Technology.” We are honored to contribute to the construction of China’s automotive chip quality infrastructure. Looking ahead, Hiwave will continue to deepen its expertise in core non-destructive testing technologies, working hand-in-hand with industry partners to drive the localization, standardization, and globalization of China’s automotive chip industry, enabling “China’s solutions” to better serve the global intelligent automotive ecosystem.
