Product features 1.Mechanical-Electrical Characteristics Mechanical-Electr……
Product features
1.Mechanical-Electrical Characteristics
| Mechanical-Electrical Characteristics | Specifications |
| Overall Dimensions | 750mm X 700mm X 1350mm |
| Water Tank Size | 350mm X 220mm X 120mm |
| Effective Scan Range | 230mm X 70mm X 50mm |
| Maximum Scan Speed | 1000mm/s |
| Recommended Image Resolution | 1 ~ 4000um |
| Repeatability Positioning Accuracy | X/Y ≤ ±0.01mm Z ≤ ±0.02mm |
| Water Supply/Drainage | Pressure water supply, pump drainage |
2.Configuration
| Name | Specifications |
| Scanning System | X-axis: Linear Motor Module; Y-axis: Lead Screw Module; Z-axis: Lead Screw Module |
| Water Tank | 350mm X 220mm X 120mm |
| Ultrasonic Transmitter & Receiver | Bandwidth 1 – 65MHz |
| High-Speed Data Acquisition Card | Sampling Frequency 500MHz |
| Industrial PC | i5 Processor, 32GB RAM, 1TB Hard Drive, Windows 10 64-bit Operating System |
| Monitor | Two 21.5″ LCD Monitors |
| Inspection Software | Hiwave Ultrasonic Non-Destructive Testing Software |
3.Software Functions:
(1)Manual Scanning: Manually generates C-scan images to reflect the bonding status of the inspected joint interface, displaying inspection results numerically, including bond rate and defect area. Default calculation method for bond rate is positive peak value.
(2)Probe Alignment with C-scan Image: Moves the probe to the corresponding position of the actual inspected part by clicking on specific pixels in the C-scan image.
(3)Manual Analysis: Performs various edits on generated C-scan images, including framing (confirming valid analysis areas), distance measurement, threshold modification, image cropping, and arc surface compensation for curved surfaces.
(4)Multiple Scanning Modes: Includes A-scan, B-scan, C-scan, quick scan, auto scan, regional scan, and more.
(5)Automatic Report Generation: Generates a comprehensive report post-scan, including final scan images and various scan parameters, allowing for automatic editing and output of the report document.
(6)Probe Management: Enables replacement or editing of probes of different models.
(7)One-click Calibration: Automatically corrects device coordinate offsets and energy changes, ensuring the accuracy and stability of test results.
(8)Stainless Steel Standard Intensity: Comes with a stainless steel standard block compliant with GBT 11259-2015, defining its ultrasonic reflection intensity as 100 STSS. Other materials are calibrated relative to STSS.
(9)Defect Detection Capability: Identifies welding defects, bonding defects, encapsulation delamination, film voids, and good areas. Automatically counts and calculates defect dimensions and areas. Customized services are also available upon request.
(10)Sound Speed Detection: Determines the propagation velocity of sound in the material under test.
Applications:
Encapsulated IC, Power Devices, MCM multi-chip modules,Diamond Compacts,Electronic Soldered Components,Ceramic Materials and so on
Hiwave specializes in providing ultrasonic scanning microscopes (USM) for precise non-destructive testing in semiconductors and electronics.
