Application of Hiwave Ultrasonic Scanning Microscopy in Target Material Defect Detection
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author：admin
source：Hiwave
time：2025-02-17
catogory：Industry News
With the rapid development of the electronic information industry, the application of thin film science has become increasingly widespread. The source material used in……
With the rapid development of the electronic information industry, the application of thin film science has become increasingly widespread. The source material used in magnetron sputtering deposition technology—targets—is highly favored due to its ability to produce films with high density and excellent adhesion. Since the 1990s, the development of new devices and materials in the microelectronics industry has been rapid, and electronic, magnetic, optical, optoelectronic, and superconducting films have been widely applied in high-tech and industrial fields, significantly driving the continuous expansion of the sputtering target market.
As a critical raw material for magnetron sputtering coating, the quality of targets directly affects the performance, production efficiency, and cost of the coatings. Therefore, the quality requirements for sputtering targets are continuously increasing. In addition to key characteristics such as grain size, purity, defects, resistance, and composition, the bonding rate of targets is also an important quality indicator. This places higher demands on the non-destructive testing of targets.
The water immersion ultrasonic C-scan inspection system uses a fully water-immersed ultrasonic flaw detection method, effectively meeting these high-standard testing needs and ensuring that target quality meets stringent technical specifications. By utilizing longitudinal ultrasonic waves vertically incident into the workpiece and collecting reflected signals, this system can detect various internal defects within the workpiece and generate visualized inspection results.
Hiwave-S600 Ultrasonic Scanning Microscope Equipment Parameters and Functions:
Scanning Modes:
Equipped with A (point scanning), B (longitudinal scanning), C (transverse scanning), transmission scanning (requires configuration of transmission scanning unit and receiver probe option), multi-layer scanning, Tray scanning, thickness measurement, and other series of scanning modes.
Quantitative Analysis Function:
Provides quantitative analysis capabilities, visually displaying the location, shape, and size of internal defects in the tested component through images. It performs defect size and area statistics, automatically calculates the percentage of defects relative to the measured area, marks defect sizes, and includes thickness and distance measurement functions.
Image Coloring Function:
Features image coloring based on phase inversion for automatic coloring; allows manual coloring based on grayscale levels; and supports automatic coloring according to changes in thickness.
Application Flexibility:
Suitable for rapid scanning and analysis of individual components, as well as batch placement of samples for simultaneous defect identification, quickly screening out defective products.
Compatibility:
Compatible with ultrasonic probes ranging from 1 MHz to 300 MHz.
Software:
The detection software is independently developed with both Chinese and English interfaces. It can be continuously upgraded according to customer needs to enhance functionality.
Hiwave-S600 Ultrasonic Scanning Microscope Target Material Inspection Case Study
Advantages of Hiwave Ultrasonic Scanning Microscope Compared to Other Non-Destructive Testing Methods:
Versatile Material Testing: It can perform non-destructive inspections on a variety of materials, including metals, non-metals, and composite materials. Examples include ITO ceramics, tungsten, molybdenum, aluminum, titanium, tantalum, cadmium sulfide, zinc telluride, and other cylindrical or flat-shaped workpieces or target materials.
Cost-Effective and Fast: The testing cost is low, the speed is fast, and the scan results are intuitive. This method is environmentally friendly and harmless to human health.
High Penetration Capability: It has strong penetration capabilities, allowing it to detect internal defects in a wide range of workpieces.
Accurate Positioning and High Sensitivity: It provides accurate defect localization and high sensitivity, capable of detecting very small defects. The detection rate for area-type defects is particularly high.
